Ambarella brings its edge AI SoC portfolio to Embedded World with live demos spanning robotics, industrial automation, ...

Infineon takes the floor at Embedded World 2026 in Nuremberg, March 10 – 12 (Hall 4A, Booth 138) with live demonstrations ...

The single-crimp N-Type connectors from Amphenol RF are designed for field installation using a one-step ferrule crimp that eliminates separate contact crimping. Rated IP67 when mated, the connectors ...

Rambus Inc. has released its HBM4E Controller IP designed for next-generation AI accelerators and high-performance computing.

As digital data streams increase in speed and data rate, losses in PCB traces become ever more of a bottleneck. Moving optics ...

Nordic Semiconductor will showcase its three-series cellular IoT portfolio expansion. The nRF92 Series integrates an application MCU, Nordic’s Axon NPU for edge AI, multi-constellation GNSS, Wi-Fi ...

NEXCOM heads to Embedded World 2026 in Nuremberg next week with a lineup spanning AI-edge computing, robotics, and smart city platforms. The centerpiece is the APPC C21-01 series. These fanless panel ...

Ambarella brings its edge AI SoC portfolio to Embedded World with live demos spanning robotics, industrial automation, automotive, and AIoT applications. The booth focuses on demonstrating AI ...

The MM5627 from Menlo Microsystems is an 80 Gbps differential switch designed for high-speed test and validation of AI GPUs, CPUs and advanced semiconductor ICs. Part of the MM562x series, the device ...

This article explains how adhesives and sealants improve connector reliability through moisture barriers, vibration damping, and mechanical stabilization.

Physical artificial intelligence (PAI) is the application of AI and machine learning (ML) algorithms to enable autonomous ...

Join me in exploring travel for engineers in Barcelona, home to innovative design and the works of Antoni Gaudí.